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Aerospace

SolderStar highlighting latest reflow tools at Productronica

Specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, UK-based SolderStar, has announced that it will highlight its latest line-up of tools for all aspects of reflow techniques at Productronica 2015 in Germany from 10-13 November.

Advanced profiling solutions will be presented including the pioneering Automatic Profiling System (APS). APS is a full time system for profiling each and every PCB soldered in a convection reflow oven. The APS system allows 100% checking of temperature profiles, an automatic analysis of the profile, and checking of production parameters against production limits. The computer software tracks the progress of the PCB through the oven allowing for the most accurate calculation of the profile seen at product level.

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Mark Stansfield, managing director at SolderStar Ltd said: “SolderStar APS has been re-engineered so the temperature probes are smaller, allowing them to be positioned closer to the PCB providing a much more accurate temperature measurement in the vicinity of the electronic assembly during soldering. The smaller size also reduces the danger of the probe shadowing the product. APS also includes a sophisticated computer algorithm which uses a reference profile, captured once from a traditional profiling system along with live readings from the process, to calculate a mathematical profile for each PCB exiting the oven. The algorithm used by the software to produce this profile from the live readings and reference profile has been modified based on the input of a leading mathematician to yield more accurate results.

“Productronica will give us the opportunity to demonstrate the capabilities of the APS as well as other new products in our portfolio, including SMARTLine, a data capture system which provides a network link and software for streaming live process data from the ovens on the production floor. The system is scalable and provides all the tools today to allow ‘big data’ capture from single test/evaluations lines to full smart factories scenarios.”

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