Altus supports Heller Industries to introduce new Vacuum Reflow Oven

Image courtesy Altus

As electronic products continue to become smaller, more advanced and complex in construction, it is important to have soldering processes which can be adapted to achieve solder joints with fewer voids to increase reliability. Heller Industries’ new Nitrogen Vacuum Reflow Oven 1911MK5-VR is helping manufacturers to achieve the best results thanks to its ground-breaking design.

With 11 zones, a vacuum chamber, closed loop nitrogen atmosphere control and the company’s award winning COOL-PIPE flux management system, which traps the flux so it can be easily removed and replaced while the oven is running, it has all the elements to ensure fast throughput and process flexibility.

Mike Todd, Operations Manager Assembly, Soldering & Cleaning Products said: “Heller Industries will be introducing visitors at SMTconnect to their newest reflow oven, which is a real game-changer. Heller vacuum reflow ovens provide best-in-class performance for removing voids in solder joints and interfaces. The 1911MK5-VR not only achieves ambitious performance metrics to assist manufacturers in streamlining SMT assembly, but it targets voiding ratios of less than 2% and cycle times of 40 seconds for single lane implementation and 20 seconds for dual-lane systems, impressive figures that will positively impact those that use it.

“Importantly it includes 11 zones, ten delivering convection heating, with one infrared (IR) zone strategically located inside the oven's vacuum chamber. This provides proven benefits in void-less solder paste reflow processing, resulting in long-term solder joint reliability.

“Heller Industries will be demonstrating the new system from their stand located in Hall 4. We will be supporting the company by offering expert advice on Heller Industries range of products including the 1911MK5-VR from our UK facility.”

Heller Industries systems support customers from entry level NPI volumes, through to the fastest throughput needed. The new 1911MK5-VR Nitrogen Vacuum Reflow Oven is no exception. With a cycle time of just 40 seconds, it maintains solder paste reflow specification, including liquidous times of under 60 seconds. In addition, the oven is suitable for high temperature applications up to 450°C. It also benefits from IN-ZONE IR Heating to prevent flux residues precipitating within the vacuum chamber routine lubrication PM every four months.