General Atomics

BAE Systems’ Endura demos radiation-hardened capability for space missions

BAE Systems has successfully demonstrated the ability of its Endura system-on-chip (Soc) space processor to operate resiliently in natural space and the most severe strategic radiation environments.

Joe…


bae systems
Image courtesy BAE Systems

BAE Systems has successfully demonstrated the ability of its Endura system-on-chip (Soc) space processor to operate resiliently in natural space and the most severe strategic radiation environments.

Joe Dziezynski, Space Systems product line director at BAE Systems, said: “This milestone positions the Endura SoC as a leading high-performance processor for the space community. “Leveraging commercial foundry technology, Endura delivers a smaller, lower-power and more cost-effective solution for missions requiring survivability in harsh radiation.”

The Endura SoC was developed with BAE Systems’ commercial radiation-hardened 45 nanometer (RH45 nm) technology, built on GlobalFoundries’ (GF) commercial, 45nm silicon-on-insulator platform with secure manufacturing through GF’s New York fab. RH45 technology brings a qualified library of advanced, commercially licensed capabilities and proven application-specific integrated circuit (ASIC) design and manufacturing methods. The strategic radiation-hardened testing further demonstrates that this technology can increase survivability of other space system elements, including single board computers (SBC).

Ezra Hall, senior director of aerospace and defense at GF, said: “GlobalFoundries’ facility in Malta, New York, is a cornerstone of trusted US semiconductor manufacturing, providing the secure, domestic foundational technologies needed for mission-critical aerospace and defence applications. 

“Working with the US government, GF and BAE Systems are extending strategic manufacturing and technology advancements to address the evolving needs for resilient, trusted and scalable microelectronics.”

The SoC is being integrated into BAE Systems’ next-generation Endura product line, which will include general purpose processing, networking, secure boot and other functionality. Endura products provide a powerful processor core with integrated Level 1 and 2 caching. They also include advanced FPGA components enabling mission specific acceleration and hardware accelerated input/output to deliver exponential improvements in size, speed, power and processing efficiency. As a platform-agnostic supplier, BAE Systems develops and produces high-reliability space electronics, from standard components and SBCs to complete system payloads. The company will continue to provide products for High Reliability Class A missions as well as Class C/D lower mission assurance requirements with associated price points.

BAE Systems is currently accepting orders with rapid delivery for Software Development Units featuring the Endura SoC. Work is performed by the company’s Space Systems group in Manassas, Virginia. This facility is a US Department of War Category 1A Microelectronics Trusted Source, covering design, aggregation, broker, packaging, assembly and test services.

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