Merlin invests in latest via plugging service
The THP35 is the most advanced system currently available and gives the ability to reliably fill all via types by way of its vacuum head.
This now gives Merlin the in house capability for 100% filling of both through and blind vias to IPC-4761 Type VII offering the PCB designer the option to use ‘Via in Pad’ technology, helping to fan out the latest BGA designs, freeing up space, and potentially removing the need for the costly process of copper filling blind vias and protecting the via plating from harsh environments for space, avionics and military applications.
Chairman Neil Martin said: “This is another demonstration of our commitment to invest in the latest and best technology available to ensure that Merlin Circuit Technology Limited maintains its position as one of Europe’s leading PCB manufacturers.”
