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Defence

Cobham selected as prime contractor for US Navy’s SeaPort-NxG

Cobham's Advanced Electronic Solutions (CAES) has been awarded a SeaPort Next Generation (SeaPort-NxG) prime contract to provide engineering and programme management support services to the United States Navy and Marine Corps.


Courtesy Cobham

Managed by the Naval Sea Systems Command (NAVSEA), the SeaPort-NxG is the follow-on to the Seaport-e primary Multiple-Award Indefinite-Delivery/Indefinite-Quantity (IDIQ) contract for soliciting supplier services. It has a five-year base and five-year option ordering period, with a potential value of $5 billion per year or $50 billion over the 10-year contract life span for all Seaport-NxG awardees, to procure future support services requirements. Cobham will be competing with the other prime contractors for task order awards from a variety of Navy agencies.

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 “We are honoured to be selected as a prime contractor for the U.S. Navy and Marine Corps’ SeaPort-NxG contract,” said Jeff Hassannia, Senior Vice President of Business Development and Technology, Cobham Advanced Electronic Solutions. “Cobham’s advanced electronics portfolio aligns quite well with the priorities of the US Navy, Marine Corps and Department of Defense as our RF, microwave and millimeter wave technologies are well-suited to address and counter new threats found in today’s near-peer geopolitical environment. We will operate the SeaPort-NxG from our CAES IDIQ Service Center, where we administer our enterprise IDIQ contracts, which gives our customers access to the combined capabilities of all CAES technologies for complete solutions and reduced time to market.”

Cobham Advanced Electronic Solutions provides a number of mission-critical and specialised solutions for electronic warfare, communication, navigation and identification (CNI), guided munitions, radar, space and commercial applications. These solutions include RF, microwave and millimetre wave microelectronic technologies comprising many aspects of a RF front-end, including antennas and apertures, transmit/receive modules, digital receivers and exciters, frequency converters, synthesisers, pre-selectors, switch matrices, integrated microwave assemblies, waveguides, cables, rotary joints as well as radiation-hardened and high reliability microelectronics.

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